Perbezaan antara pes pateri suhu tinggi dan pes pateri suhu rendah

Secara umumnya, pes pateri suhu tinggi biasanya terdiri daripada unsur timah, perak, tembaga dan logam lain, dan takat lebur konvensional melebihi 217 darjah. Dalam pemprosesan cip LED, kebolehpercayaan tampal pateri bebas-suhu tinggi-adalah agak tinggi dan ia tidak mudah didesodir dan retak.

Takat lebur pes pateri suhu rendah-konvensional ialah 138 darjah . Apabila komponen tampalan tidak dapat menahan suhu 200 darjah atau lebih tinggi dan proses pengaliran semula tampalan diperlukan, tampal pateri bersuhu{3}}rendah hendaklah digunakan untuk proses kimpalan. Ia tidak dapat menahan pematerian aliran semula-suhu tinggi bagi asal dan PCB. Komposisi aloinya ialah aloi bismut timah. Suhu puncak pematerian aliran semula pes pateri suhu rendah ialah 170-200 darjah.

Tampal pateri suhu tinggi:

1. Ia mempunyai prestasi rolling dan tin jatuh cetakan yang baik, dan juga boleh melengkapkan cetakan tepat untuk pad dengan jarak serendah 0.3mm.

2. Several hours after the solder paste is printed, it still maintains its original shape without collapse, and the patch elements will not be offset.

3. It can meet the requirements of different grades of welding equipment, does not need to complete welding in nitrogen filled environment, and can still show good welding performance in a wide range of reflow furnace temperature.

4. The residue of high-temperature solder paste after welding is very little, colorless, has high insulation resistance, will not corrode PCB, and can meet the requirements of no cleaning.

5. It can be used in paste in hole process.

Pes pematerian suhu rendah:

1. Excellent printability, eliminating omission, depression and fast knot in the printing process.

2. Good wettability, bright, uniform and full solder joints.

3. Suitable for wide process and fast printing.

4. Fully comply with ROHS standards.

       High temperature solder paste is suitable for high temperature welding components and PCB; Low temperature solder paste is suitable for components or PCBs that cannot withstand high temperature welding, such as heatsink module soldering, led soldering, high frequency welding and so on.

     The alloy composition of high temperature solder paste is generally tin, silver and copper (SAC for short); The alloy composition of low-temperature solder paste is generally Sn Bi series, including various alloy components such as SnBi, snbiag and snbicu. Sn42bi58 is a eutectic alloy with a melting point of 138 degree , and other alloy components have no eutectic point and different melting points.